Packaging Module Engineer

Job Description

The Role and Impact

As a Packaging Module Engineer, you will play a pivotal role in shaping Intel's advanced packaging solutions that directly impact the delivery, performance, and sustainability of cutting-edge products. By applying scientific and engineering principles, you will design and develop innovative packaging solutions that ensure the secure transportation and optimal performance of Intel's products globally. Joining Intel means contributing to groundbreaking projects, collaborating with industry-leading teams, and driving advancements that align with Intel's mission to deliver world-class technology solutions. This role will empower you to influence manufacturing processes, enhance efficiency, and support Intel's growth in the competitive semiconductor industry.

Key Responsibilities will include but are not limited to:

• Design, develop, and qualify packaging solutions and materials that meet product and regulatory requirements.

• Lead packaging development processes, including artwork creation, concepts, prototypes, qualification testing, and specification documentation.

• Collaborate with manufacturing, logistics, regulatory, and supply chain partners to ensure packaging solutions meet operational needs.

• Identify and implement cost-saving, waste-reduction, and efficiency improvement measures for packaging processes.

• Conduct risk analysis to ensure packaging solutions comply with regulations and align with Intel's quality standards.

• Consult with cross-organizational teams on branding, marketing, SKUs, labeling, and bills of material requirements for shipments into Intel's distribution channel.

• Evaluate and qualify vendors to ensure high-quality packaging manufacturing startup and scalability.

• Benchmark packaging designs and processes against industry standards to maintain a competitive edge.

• Document and maintain technical specifications for packaging solutions to ensure consistency and clarity.

Behavioral traits that we are looking for:

• Demonstrated problem-solving skills in packaging development or manufacturing.

• Effective communication skills to collaborate with cross-organizational teams and external vendors and customers

Intel invests in our people and offers a complete and competitive package of benefits employees and their families through every stage of life.

See Intel Benefits for more details.

Qualifications
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Note:

For information on Intel's immigration sponsorship guidelines, please see

Intel U.S. Immigration Sponsorship Information

Minimum Qualifications and Experience:

Possess a Master's degree in Engineering, Physics, Chemistry, or a related STEM field with 1+ years of educational or work experience. Or a PhD degree in the same fields with 6+ months of educational or work experience.

Your experience described above must be in the following:

• Product packaging assembly processes and production methodologies.

• Statistical process control (SPC) principles and design of experiments (DOE) techniques.

• Analytical skills with proficiency in data analysis and risk assessment methods.

• Design for manufacturing (DFM) practices and packaging test criteria.

Preferred Qualifications and Experience:

• Experience with Surface Mount Technologies, solder joint formation/quality/reliability, and package certification methodologies.

• Experience leading technical teams, influencing stakeholders, and managing resources and timelines in a matrixed environment.

• Familiarity with semiconductor device fabrication processes and packaging process flows.

• A track record of delivering results in time-critical technical projects involving innovation and strategic planning.

• Apply problem-solving techniques and fundamental engineering concepts to create novel, efficient solutions.

We are looking for individuals who are passionate about engineering excellence and sustainability. Apply today to help drive Intel's global impact through innovative packaging solutions.

Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.



Annual Salary Range for jobs which could be performed in the US $127,400.00-$179,900.00
Salary range dependent on a number of factors including location and experience


Working Model
This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.