Mid-level Microelectronics Assembler-M

Temp to Perm and open to Direct Hire for the right candidate Key Responsibilities • Perform die attach operations (epoxy and/or eutectic methods) on ceramic substrates and hybrid circuits, with support from senior staff on complex builds • Execute wire bonding (gold and/or aluminum wedge/ball bonding) to MIL-STD-883 or equivalent standards • Perform fly wire (jumper wire) installation and tack wire bonding/staking for circuit interconnects • Solder fine-pitch components, leads, and interconnects under microscope • Assist with or perform lid seal operations (seam seal, parallel seam welding, and/or solder seal) under supervision • Conduct in-process visual inspections per IPC/MIL specifications • Read and interpret schematics, assembly drawings, and work instructions • Maintain accurate documentation/travelers for traceability • Escalate process issues to Senior Operator and support troubleshooting efforts • Maintain a clean, ESD-safe workstation and comply with all safety protocols