Electro-Mechanical Engineer - Advanced Packaging & Thermal (3DHI)

Electro-Mechanical Engineer - Advanced Packaging & Thermal (3DHI) 12728 Location: Orlando, FL (Onsite) Pay: $93.94 per hour, overtime eligible Employment type: Contract (W-2), approximately 6 months Schedule: 4/10 A, 1st shift; onsite full time Security clearance: No clearance to start, but candidates must be able to obtain one About the role Own the package design behind high reliability microelectronics. You will design multichip packages and the thermal management that keeps them alive, drive the analysis and qualification behind them, and run the failure investigations when interfaces fail. What you will do Design multichip package devices including package substrates, integrated heat spreaders and attach mechanisms, stiffeners, and complex thermal management system integration for high thermal dissipation Own heat transfer and thermal dissipation, structural integrity and mechanical survivability of completed packages across their operational life Work with mechanical and electrical analysts on finite element analysis and multiphysics models for thermal cycling and reliability, power integrity and electrical performance, and mechanical stress including shock and vibration Define and execute packaging qualification plans to project requirements and JEDEC and MIL-SPEC standards, including highly accelerated stress testing Investigate and perform failure analysis on critical component interfaces and intermetallic connections, including cracked solder joints, delaminated layers and warped substrates Implement corrective actions, feed findings into product revisions and capture lessons learned What you bring Bachelor of Science in Electrical Engineering, Mechanical Engineering or a closely related STEM field, master's or PhD preferred; or 15+ years of electromechanical engineering experience without a degree 11+ years across: 3D heterogeneous integration, advanced packaging, microelectronics design Technical or project leadership supporting production of high reliability electronics Proficient in Creo modelling and electromechanical system design Project leadership across the engineering and production lifecycle: scoping, sizing, cost estimation, planning, scheduling, staffing, tracking and earned value management Strong written and oral communication with co-workers, leaders and customers Able to obtain a security clearance Nice to have JEDEC and MIL-SPEC qualification experience Highly accelerated stress testing Finite element analysis and multiphysics simulation Failure analysis on solder joints and package interfaces